Four hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following:
1. Dual socket R3 (LGA 2011) supports
Intel® Xeon® processor E5-2600 v3
family; QPI up to 9.6GT/s
2. Up to 1TB ECC LRDIMM, 512GB ECC
RDIMM, up to 2133MHz; 16x DIMM
sockets
3. 1x PCI-E 3.0 x16 slot
4. Intel® i350-AM2 Dual port GbE LAN
5. Integrated IPMI 2.0 with KVM and
Dedicated LAN
6. 6x 2.5" Hot-swap SAS/SATA HDD
Bays
7. LSI 3108 SAS3 controller (6 ports);
RAID 0, 1, 5, 6, 10, 50, 60
8. 2000W Redundant Power Supplies
Titanium Level (96%)
Parts List - (Items Included)
Part Number
Qty
Description
Motherboard / Chassis MBD-X10DRT-P
CSE-217HQ+-R2K04B 4
1 Super X10DRT-P Motherboards
2U Chassis
Backplane BPN-ADP-S3108L-H6IRP 4 LSI 3108, SAS 12Gbps (x6 internal)
Backplane BPN-SAS3-217HQ 1 ,RoHS/REACH,PBF 2U Twin Square Backplane, support 24 SAS3/SATA3 HDD (2.5") with Hot Swapping. Per node for 6 HDDs. PWM fan control, HDD spin up and failure LED supported.
Label LBL-0108 1 CAUTION LABEL FOR REDUNDANT PWR SYSTEMS
Manual MNL-1659-QRG 1 2028TP-HC1R/HC1TR/HC1FR, QRG
Riser Card RSC-R1UTP-E16R 4 ,RoHS/REACH,PBF
Heatsink / Retention SNK-P0057PS 4 1U High Performance Passive CPU Heat Sink for X9, X10 Systems Equipped w/ a Narrow ILM MB
Heatsink / Retention SNK-P0047PSM 4 1U Passive Front CPU Heat Sink w/ a Middle Air Channel for X9, X10 2U Twin^2+ and Twin Pro^2 Series Servers
Air Shroud MCP-310-21703-0B
or
MCP-310-21702-0B 4 TwinPro 217HQ+/827HQ+ X10 plastic air shroud
or
TwinPro 217HQ+/827HQ+ X10 mylay air shroud
Power Supply PWS-2K04A-1R
or
PWS-2K02P-1R 2 2000W Redundant Titanium Level Power Supplies
or
2000W Redundant Platinum Level Power Supplies
Optional Parts List
Part Number Qty Description
SuperCap Kit BTR-CV3108-TP1 - LSI 3108 CacheVault kit for TwinPro
Onsite Service Program OS4HR3/2/1 - 3/2/1-year onsite 24x7x4 service
Onsite Service Program OSNBD3/2/1 - 3/2/1-year onsite NBD service
Software SFT-OOB-LIC 4 OOB Management Package (per node license)
Software SFT-DCMS-Single 4 DataCenter Management Package (per node license)
