Intel® Xeon® Scalable Processors., Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 3 UPI up to 10.4 GT/s, CPU1: Skylake-F CPU supported
Intel® C621
Up to 1TB 3DS ECC RDIMM and DDR4-2666MHz, Up to 2TB 3DS ECC LRDIMM, in 16 DIMM slots
3 PCI-E 3.0 x16,
4 PCI-E 3.0 x8
M.2 Interface: PCI-E 3.0 x4 and PCI-E 3.0 x4
M.2 Form Factor: 22110
M.2 Key: M-Key (RAID 0,1 support)
1 VGA port
Intel® C621 controller for 10 SATA3 (6 Gbps) ports; RAID 0,1,5,10
Dual LAN with 1GbE with Marvell® 88E1512
Parts List (Bulk Package)
Name Part Number Qty Description
Motherboard MBD-X11DPH-i 1 X11DPH-i Motherboard
I/O Shield MCP-260-00042-0N 1 STD I/O SHIELD
I/O Cables CBL-0044L 2 SATA CABLE 61CM FLAT S-S PBF
Optional Parts List
Name Part Number Qty Description
TPM security module (optional, not included) AOM-TPM-9670V 1 SPI capable TPM 2.0 with Infineon 9670 controller with vertical form factor
TPM security module (optional, not included) AOM-TPM-9670H 1 SPI capable TPM 2.0 with Infineon 9670 controller with horizontal form factor
TPM security module (optional, not included) AOM-TPM-9671V 1 SPI capable TPM 1.2 with Infineon 9670 controller with vertical form factor
TPM security module (optional, not included) AOM-TPM-9671H 1 SPI capable TPM 1.2 with Infineon 9670 controller with horizontal form factor