Key Features
  - Compute Intensive Application
  - HPC, Data Center, Enterprise
    Server
  - Hyperscale / Hyperconverged
Four hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following:
1. Dual Socket P (LGA 3647) support
    2nd Gen. Intel® Xeon® Scalable
    processors (Cascade Lake/Skylake)‡
2. 24 DIMMs; up to 6TB 3DS ECC
    DDR4-2933MHz† RDIMM/LRDIMM,
    Supports Intel® Optane™ DCPMM††
3. 2 PCI-E 3.0 x16 (LP) slot; 1 SIOM
    card support (flexible networking)
    Note: must bundle with Network card
4. 6 SAS3 or 4 NVMe + 2 SAS3
    Hot-swap 2.5" drive bays;
    2 M.2 SATA3 or NVMe support
5. SAS3 support via Broadcom 3008;
    IT mode
6. 1 Carrier Card slot (M.2 support)
7. IPMI 2.0 + KVM with dedicated LAN
8. Video via Aspeed AST2500 BMC
9. 4 Heavy duty 8cm PWM fans with
    air shroud
10. 2200W Redundant Power Supplies
    Titanium Level (96%)

Parts List - (Items Included)

 

Part Number

Qty

Description

Motherboard / Chassis MBD-X11DPT-B

CSE-217BHQ+-R2K22BP2 4

1 Super X11DPT-B Motherboard

2U Chassis

Backplane BPN-ADP-6S3008N4-1UB 4 Big Twin 1U hybrid ADP supporting 6x SAS3 and 4x NVMe

Backplane BPN-SAS3-217BHQ-N4 1 2U 4-Node 24-Port Backplane Supports 2x2.5\\" SATA3/SAS3 SSD/HDD and 4x2.5\\" SATA3/SAS3/NVMe Stoage Media per Node

Cable 1 CBL-PWCD-0578 2 PWCD,US,IEC60320 C14 TO C13,3FT,14AWG

Drive Tray(s) MCP-220-00141-0B-BULK 8 Black Gen3 hot-swap 2.5 inch HDD tray with lock improved EMI

Drive Tray(s) MCP-220-00144-0B-BULK 16 Black Gen3 hot-swap 2.5 inch HDD tray with lock, orange tab

Parts MCP-240-21730-0N 1 217B BigTwin type I (Impact) BPN retention bkt w/ foam assy

Air Shroud MCP-310-21718-0B 4 Bigtwin air box for X11DPT-B(4pcs/set)

Air Shroud MCP-310-21724-0B 4 Bigtwin 2U4N plastic air shroud (2pcs) for Cascade lake MB

Manual MNL-1948-QRG 1 2029BT-H(N/T/NC0)R Quick Reference Guide

Riser Card RSC-P-6 4 RSC-P-6 (1U LHS TwinPro RSC with 1 PCI-Ex16),RoHS

Riser Card RSC-R1UTP-E16R 4 1U RHS TwinPro Riser card with one PCI-E x16 slot

Heatsink / Retention SNK-P0067PS 4 1U Passive CPU Heat Sink for X11 Purley Platform Equipped with a Narrow Retention Mechanism

Heatsink / Retention SNK-P0067PSM 4 1U Passive CPU Heat Sink with a 26-mm Wide Middle Air Channel for X11 Purley Platform Equipped with a Narrow Retention Mechanism

Power Supply PWS-2K22A-1R 2 1U 2200W Redundant Power Supply Titanium, 45(W) X 40(H) X 48

Optional Parts List

  Part Number Qty Description

TPM security module AOM-TPM-9670H 1 SPI capable TPM 2.0 with Infineon 9670 controller,

Horizontal form factor

TPM security module AOM-TPM-9671H 1 SPI capable TPM 1.2 with Infineon 9670 controller,

Horizontal form factor

Intel VROC RAID Key AOC-VROCINTMOD

AOC-VROCSTNMOD

AOC-VROCPREMOD 1

1

1 Intel VROC, RAID 0, 1, 5, 10 (Intel SSD Only)

Intel VROC Standard, RAID 0, 1, 10

Intel VROC Premium, RAID 0, 1, 5, 10

Global Services & Support OS4HR3/2/1

OSNBD3/2/1 -

- 3/2/1-year onsite 24x7x4 service

3/2/1-year onsite NBD service

Software SFT-OOB-LIC • 1 OOB Management Package (per node license)

Software SFT-DCMS-Single 1 DataCenter Management Package (per node license)

SuperDOM - - Supermicro SATA DOM Solutions [Details]

Network Card(s) AOC-S40G-i2Q

AOC-SGP-i2

AOC-SGP-i4

AOC-STG-b4S

AOC-STGN-i2S

AOC-STGN-i1S

AOC-STG-i2T

AOC-STG-i2 -

-

-

-

-

-

-

- Standard LP 2-port 40GbE controller, based on Intel Fortville XL710

Standard LP, 2x GbE RJ45, PCI-E x4, Intel i350AM2

Standard LP, 4x GbE RJ45, PCI-E x4, Intel i350

Standard LP, 4x 10GbE SFP+, PCI-E x8, Broadcom BCM57840S

Standard LP, 2x 10GbE SFP+, PCI-E x8, Intel 82599ES

Standard LP, 1x 10GbE SFP+, PCI-E x8, Intel 82599EN

Standard LP, 2x 10GbE RJ45, PCI-E x8, Intel X540

Standard LP, 2x 10GbE CX4, PCI-E x8, Intel 82598EB

Carrier Card(s) AOC-SMG3-2H8M2-B

AOC-SMG2-2TM2 -

- 2x Hybrid NVMe/SATA M.2 carrier for BigTwin,HF,RoHS

2x SATA M.2 RAID 1 adapter for BigTwin,HF,RoHS