Key Features
  - Compute Intensive Application
  - HPC, Data Center
  - Enterprise Server
  - Financial Analysis
  - Mission-critical applications
Four hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following:
1. Dual Socket P (LGA 3647) support
    2nd Gen. Intel® Xeon® Scalable
    processors (Cascade Lake/Skylake)‡
2. 16 DIMMs; up to 4TB 3DS ECC
    DDR4-2933MHz† RDIMM/LRDIMM,
    Supports Intel® Optane™ DCPMM††
3. 2 PCI-E 3.0 x16 (LP) slots
4. Flexible Networking support via SIOM;
    Dedicated IPMI 2.0 LAN
5. 3 Hot-swap 3.5" SAS/SATA drive bays
6. Broadcom 3008 SAS3 controller;
    RAID 0, 1, 1E
7. Mini-mSATA (half size) support
8. Up to 2200W Redundant Power Supplies
    Titanium Level (96%)

Parts List - (Items Included)

 

Part Number

Qty

Description

Motherboard / Chassis MBD-X11DPT-PS

CSE-827HQ+-R2K20BP2 4

1 Super X11DPT-PS Motherboard

2U Chassis

Backplane BPN-ADP-S3008L-L6IP 4 LSI 3008, SAS 12Gbs (X6 port inside)

Backplane BPN-SAS3-827HQ2 1 2U 12-Port 4-Node Backplane Supports 3x3.5

Cable 1 CBL-PWCD-0578 2 PWCD,US,IEC60320 C14 TO C13,3FT,14AWG

Parts MCP-240-82715-0N 1 TwinPro SC827HQ+ BPN retention bracket assembly

Air Shroud MCP-310-21707-0B 4 SC217HQ+ TwinPro 2pcs air shroud set for X11 DPT-PS

Riser Card RSC-P-6 4 RSC-P-6 (1U LHS TwinPro RSC with 1 PCI-Ex16),RoHS

Riser Card RSC-R1UTP-E16R 4 1U RHS TwinPro Riser card with one PCI-E x16 slot

Heatsink / Retention SNK-P0067PS 4 1U Passive CPU Heat Sink for X11 Purley Platform Equipped with a Narrow Retention Mechanism

Heatsink / Retention SNK-P0067PSM 4 1U Passive CPU Heat Sink with a 26-mm Wide Middle Air Channel for X11 Purley Platform Equipped with a Narrow Retention Mechanism

Power Supply PWS-2K20A-1R 2 1U 2200W Redundant, Titanium, 76(W) X 40(H) X 336(L) mm

FAN 1 FAN-0162L4 4 80x80x38 mm, 13.5K RPM, HCP, LMV, and LPC Cooling Fan,RoHS/REACH

Optional Parts List

  Part Number Qty Description

TPM security module (optional, not included) AOM-TPM-9670V 1 SPI capable TPM 2.0 with Infineon 9670 controller with vertical form factor

TPM security module (optional, not included) AOM-TPM-9671V 1 SPI capable TPM 1.2 with Infineon 9670 controller with vertical form factor

Add-on-Card AOC-SMG3-2H8M2 - AOC supports 2280 M.2 form factor SSD (1 NVMe or 2 SATA),

FST-SCRW-0121L is included in AOC-SMG3-2H8M2

Hot-swap 3.5" to 2.5" Hard Disk Drive Tray MCP-220-00043-0N - Black Hot-swap gen 4 3.5" to 2.5" HDD tray

Global Services & Support OS4HR3/2/1

OSNBD3/2/1 -

- 3/2/1-year onsite 24x7x4 service

3/2/1-year onsite NBD service

Software SFT-OOB-LIC • 1 OOB Management Package (per node license)

Software SFT-DCMS-Single 1 DataCenter Management Package (per node license)