Key Features
3rd Gen Intel® Xeon® Scalable processors
Dual Socket LGA-4189 (Socket P+) supported, CPU TDP supports Up to 270W TDP, 3 UPI up to 11.2 GT/s
Intel® C621A
Up to 4TB RDIMM, DDR4-3200MHz; Up to 4TB 3DS ECC LRDIMM, DDR4-3200MHz
Up to 4TB Intel® Optane™ Persistent Memory 200 Series, DDR4-3200MHz, in 18 DIMM slotsP1-DIMMB2 and P2-DIMMB2 are reserved for Intel Optane Persistent Memory 200 series only.
2 PCIe 4.0 x8,
4 PCIe 4.0 x16,
2 PCIe 4.0 NVMe x8 Internal Port(s)
M.2 Interface: 1 PCIe 4.0 x4
M.2 Form Factor: 2280/22110
M.2 Key: M-Key
Intel® C621A controller for 14 SATA3 (6 Gbps) ports; RAID 0,1,5,10
Dual LAN with 10GBase-T with Intel® X550
2 VGA (1 rear bezel, 1 front panel) ports

Standard Parts (Retail Package)

Part Number Qty Description

CPU carrier SKT-1205L-P4IC-FXC 2 CPU carrier for 3rd Gen Intel Xeon Scalable Processors

I/O Cables CBL-0476L • 

CBL-0044L • 1

2 IPASS to 4 SATA cable

57.5 cm SATA FLAT S-S PBF

I/O Shield MCP-260-00042-0N • 1 STD I/O SHIELD

Quick Reference Guide MNL-2233-QRG 1 X12DPi-N(T)6 Quick Reference Guide

Optional Parts

Part Number Qty Description

TPM security module (optional, not included) AOM-TPM-9670H

AOM-TPM-9670V

AOM-TPM-9671V

AOM-TPM-9671H 1

1

1

1 SPI capable TPM 2.0 with Infineon 9670 controller with horizontal form factor

SPI capable TPM 2.0 with Infineon 9670 controller with vertical form factor

SPI capable TPM 1.2 with Infineon 9670 controller with vertical form factor

SPI capable TPM 1.2 with Infineon 9670 controller with horizontal form factor